全生物降解改性粒子TPEE的使用特点

全生物降解改性粒子TPEE的使用特点

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真包胶:TPEE与塑料、金属等材料通过化学作用在两种材料的键合界面形成牢固的焊接或键合作用,如分子渗透、极性基团的反应性连接和键合或类似的氢键,而没有任何机械和物理作用。无需粘合剂,可通过注塑直接与金属结合。

True package adhesive: TPEE forms a strong welding or bonding effect with plastic, metal and other materials through chemical reactions at the bonding interface of the two materials, such as molecular penetration, reactive bonding of polar groups, and bonding or similar hydrogen bonding, without any mechanical or physical interaction. No adhesive required, can be directly bonded to metal through injection molding.

在这种加工方法中,TPEE和金属零件一般是整体包胶的,TPE的硬度尽可能高(70~80A及以上),这样可以达到一定的包胶效果,因为TPE和金属的包胶不具有真正意义上的附着力(化学和分子水平),金属完全被TPE的强度所包胶。此外,金属零件表面有凹槽和孔(如螺母和刀柄)。

In this processing method, TPEE and metal parts are generally encapsulated as a whole, and the hardness of TPE is as high as possible (70-80A and above), which can achieve a certain encapsulation effect because TPE and metal encapsulation do not have true adhesion (chemical and molecular level), and the metal is completely encapsulated by the strength of TPE. In addition, metal parts have grooves and holes on the surface (such as nuts and tool holders).

2.假包胶:TPEE与硬质材料(塑料、金属或其他材料)纯靠孔洞、凹槽等卡扣方式进行物理机械结合,而不是单纯依靠两种材料的化学结合。两种材料的结合面没有分子水平的直接渗透,也没有极性基团或类似氢键的反应链接键(范德华力)。用粘合剂粘合。

2. False packaging adhesive: TPEE and hard materials (plastic, metal, or other materials) rely solely on physical and mechanical bonding methods such as holes and grooves, rather than relying solely on chemical bonding between the two materials. The bonding surface of the two materials does not have direct penetration at the molecular level, nor does it have polar groups or reaction linking bonds similar to hydrogen bonds (van der Waals forces). Glue with adhesive.

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有时候对于一些特殊产品,橡胶只是部分覆盖了金属零件的相应位置,不利于TPEE与金属零件的牢固结合。在需要涂覆的金属表面涂覆一层粘合剂是一种常见的想法。但实际上,由于TPEE与橡胶的成型工艺不同,对橡胶零件与金属零件的粘接牢固度有重要影响。胶粘剂类型的选择对于这类金属制品的涂装关重要。

Sometimes for some special products, rubber only partially covers the corresponding positions of the metal parts, which is not conducive to the strong bonding between TPEE and metal parts. It is a common idea to apply a layer of adhesive on the metal surface that needs to be coated. However, in reality, due to the different molding processes between TPEE and rubber, it has a significant impact on the adhesion strength between rubber parts and metal parts. The selection of adhesive type is crucial for the coating of such metal products.

3.整体包胶

3. Overall encapsulation

整体包胶相当于注塑一个TPEE塑料件,其中硬件产品是包胶的,没有化学键合,所以包胶还是可行的。一般硬度较高的TPEE,硬度在80A以上的都可以包胶,但是包胶的五金件要整体镀膜,如果只镀膜一部分很难实现。

The overall encapsulation is equivalent to injecting a TPEE plastic part, and the hardware product is encapsulated without chemical bonding, so encapsulation is still feasible. Generally, TPEE with higher hardness can be coated with adhesive if the hardness is above 80A. However, the hardware components coated with adhesive need to be coated as a whole, and it is difficult to achieve this if only a part of the coating is coated.

4.局部包胶

4. Local encapsulation

部分灌封,硬度偏软,强度不足,不易粘接,通过五金的孔洞处理,可以加强TPEE与五金的物理机械结合,从而提高灌封牢固度。这种包胶是很多情况下硫化橡胶零件包胶五金件,但是橡胶是硫化的。如果使用注射成型,很难部分包胶TPEE和硬件。如果五金件穿孔,会在五金件产品中注入TPEE胶,这可能会提高包胶牢固度。另一个客户尝试预粘五金,然后注塑,效果不好。

Partial sealing has a soft hardness and insufficient strength, making it difficult to adhere. By treating the holes in the hardware, the physical and mechanical bonding between TPEE and hardware can be strengthened, thereby improving the sealing firmness. This type of encapsulation is often used to encapsulate vulcanized rubber parts and hardware, but rubber is vulcanized. If injection molding is used, it is difficult to partially encapsulate TPEE and hardware. If the hardware components are perforated, TPEE adhesive will be injected into the hardware products, which may improve the firmness of the packaging adhesive. Another customer tried pre bonding hardware and then injection molding, but the effect was not good.

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